Advances in CMP Polishing Technologies by Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

By Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

CMP and sharpening are the main unique approaches used to complete the surfaces of mechanical and digital or semiconductor elements. Advances in CMP/Polishing applied sciences for Manufacture of digital units offers the newest advancements and technological concepts within the box – making state of the art R&D obtainable to the broader engineering group.

Most of the functions of those procedures are stored as personal as attainable (proprietary information), and particular info aren't noticeable in specialist or technical journals and magazines. This publication makes those procedures and functions obtainable to a much wider business and educational audience.

Building at the basics of tribology – the technology of friction, put on and lubrication – the authors discover the sensible purposes of CMP and sharpening throughout numerous marketplace sectors. as a result of the excessive speed of improvement of the electronics and semiconductors undefined, the various provided approaches and purposes come from those industries.

  • Demystifies medical advancements and technological ideas, commencing them up for brand new functions and approach advancements within the semiconductor and different components of precision engineering
  • Explores inventory elimination mechanisms in CMP and sharpening, and the demanding situations fascinated by predicting the results of abrasive methods in high-precision environments
  • The authors compile the newest suggestions and learn from the united states and Japan

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